The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 30, 2007
Filed:
May. 07, 2004
Octavio Trovarelli, Dresden, DE;
Ingo Uhlendorf, Dresden, DE;
David Wallis, Dresden, DE;
Axel Brintzinger, Dresden, DE;
Octavio Trovarelli, Dresden, DE;
Ingo Uhlendorf, Dresden, DE;
David Wallis, Dresden, DE;
Axel Brintzinger, Dresden, DE;
Infineon Technologies AG, Munich, DE;
Abstract
A conductive connection is made between a semiconductor chip and an external conductor structure. An elevation element is applied on the surface of the semiconductor chip and a soldering island is arranged on the elevation element. An interconnect is produced below the soldering island as far as a bonding island or an I/O pad. Increased reliability of conductive connections of the bonding island or the I/O pad to an external conductive structure can be achieved by preventing the flowing-away of the solder and the oxidation or corrosion of the conductive layer.