Singapore, Singapore

Inciong Reynoso

This inventor holds 1 USPTO granted patent and 3 EPO patents. Top assignee: Heraeus Materials Singapore Pte. Ltd.. Active years: 2019.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Inciong Reynoso. Retrieved from https://idiyas.com/inventor/inciong-reynoso

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


 

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2019

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1 patent (USPTO):Explore Patents

Title: Inciong Reynoso: Innovator in Lead-Free Solder Technology

Introduction

Inciong Reynoso is a notable inventor based in Singapore, recognized for his contributions to the field of materials science. He has developed innovative solutions that address the growing need for environmentally friendly alternatives in solder technology.

Latest Patents

Reynoso holds a patent for a lead-free eutectic solder alloy that comprises zinc as the main component and aluminum as an alloying metal. This solder alloy is characterized by its eutectic nature, possessing a single melting point in the range of 320 to 390°C, as measured by Differential Scanning Calorimetry (DSC) at a heating rate of 5°C per minute. This innovation is significant in reducing the reliance on lead in solder materials, thereby promoting safer manufacturing practices.

Career Highlights

Inciong Reynoso is currently employed at Heraeus Materials Singapore Pte. Ltd., where he continues to advance his research and development efforts in materials science. His work has contributed to the company's reputation as a leader in high-performance materials.

Collaborations

Reynoso collaborates with talented colleagues, including Wei Chih Pan and Joseph Aaron Mesa Baquiran, who share his commitment to innovation and excellence in their respective fields.

Conclusion

Inciong Reynoso's work in developing lead-free solder technology exemplifies his dedication to creating sustainable solutions in materials science. His contributions are paving the way for safer and more efficient manufacturing processes.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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