The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 03, 2019
Filed:
Apr. 15, 2015
Applicant:
Heraeus Materials Singapore, Pte., Ltd., Singapore, SG;
Inventors:
Wei Chih Pan, Singapore, SG;
Joseph Aaron Mesa Baquiran, Singapore, SG;
Inciong Reynoso, Singapore, SG;
Assignee:
Heraeus Materials Singapore Pte., Ltd., Singapore, SG;
Primary Examiner:
Int. Cl.
CPC ...
B23K 35/28 (2006.01); B23K 35/02 (2006.01); B23K 1/00 (2006.01); C22C 18/00 (2006.01); C22C 18/04 (2006.01); B23K 35/26 (2006.01); H01L 23/495 (2006.01); H01L 23/498 (2006.01); C22C 11/00 (2006.01); C22C 13/00 (2006.01);
U.S. Cl.
CPC ...
B23K 35/282 (2013.01); B23K 1/0016 (2013.01); B23K 35/025 (2013.01); B23K 35/0227 (2013.01); B23K 35/262 (2013.01); B23K 35/268 (2013.01); C22C 18/00 (2013.01); C22C 18/04 (2013.01); H01L 23/4952 (2013.01); H01L 23/49811 (2013.01); C22C 11/00 (2013.01); C22C 13/00 (2013.01);
Abstract
A lead-free solder alloy contains zinc (Zn) as the main component and aluminum (Al) as an alloying metal. The solder alloy is a eutectic having a single melting point in the range of 320 to 390° C. (measured by DSC at a heating rate of 5° C. min-1).