In Sup Shin

Title: In Sup Shin and Semiconductor Packaging Innovation.

Introduction

In Sup Shin is an inventor associated with Suwon, South Korea, and Samsung Electronics Ltd. His work includes a patent for a semiconductor package and a method of manufacturing it.

Latest Patents

The provided information lists one patent for Shin: “Semiconductor Package and Method of Manufacturing the Same.” The invention describes a substrate with first and second regions, a wiring pattern, and a recess on the substrate’s back surface. A back-side insulating layer fills the recess, while a through via passes through the substrate and insulating layer to connect with the wiring pattern. A second recess is formed in the insulating layer above the first recess.

This design concerns the structure and manufacture of semiconductor packages, including the arrangement of substrate regions, insulating material, recesses, and electrical connections.

Career Highlights

Shin is associated with Samsung Electronics Ltd., a company active in semiconductor technology. The supplied patent information identifies his contribution to semiconductor packaging but does not provide further details about his role or career history. The record lists 1 patent.

Collaborations

Jung-Seok Ahn and Hyeong Mun Kang are identified as Shin’s coworkers. The provided information does not specify whether they collaborated with him on this patent.

Conclusion

In Sup Shin’s listed patent addresses semiconductor package construction through a combination of substrate recesses, insulating layers, and a through via, reflecting his documented contribution to semiconductor packaging innovation.