The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 28, 2026
Filed:
Feb. 23, 2023
Samsung Electronics Co., Ltd., Suwon-si, KR;
In Sup Shin, Suwon-si, KR;
Jung-Seok Ahn, Suwon-si, KR;
Hyeong Mun Kang, Suwon-si, KR;
Seung Woo Sim, Suwon-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A semiconductor package includes: a substrate including a first region and a second region at least partially surrounding the first region in a plane defined by first and second horizontal directions, wherein the substrate has a first surface and a second surface opposed to the first surface; a wiring pattern disposed on the first surface of the substrate; a first recess formed on the second surface of the substrate and in the second region of the substrate; a back side insulating layer disposed on the second surface of the substrate, wherein the back side insulating layer fills an inside of the first recess; a through via penetrating through the first region of the substrate and the back side insulating layer, wherein the through via connects to the wiring pattern; and a second recess formed in the back side insulating layer and on the first recess.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile