This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: In Lee: Semiconductor Packaging Inventor
Introduction
In Lee is an inventor based in Suwon-si, South Korea. His work includes semiconductor packaging, and he is associated with Samsung Electronics Ltd.
Latest Patents
Lee is credited with 1 patent, titled “Semiconductor package.” The invention describes a package with a substrate containing a wiring circuit and an interposer with an electrically connected interconnect circuit. Buffer chips and multiple chip stacks are arranged around the interposer, with the interconnect circuit connecting groups of semiconductor chips to the buffer chips. This configuration provides a structured approach to connecting several chip stacks within a semiconductor package.
Career Highlights
Lee’s listed patent reflects work in semiconductor packaging and chip interconnection. His association with Samsung Electronics Ltd. places this work within the company’s semiconductor technology activities.
Collaborations
Lee’s identified coworker is Joonghyun Baek. The available information does not specify the nature or scope of their collaboration.
Conclusion
In Lee’s recorded invention focuses on connecting multiple chip stacks through an interposer-based semiconductor package, highlighting his contribution to semiconductor packaging technology.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile