This inventor holds 2 USPTO granted patents. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2001-2003.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Location History:
- Kyungki-do, KR (2001)
- Suwon, KR (2003)
Company Filing History:
Years Active: 2001-2003
Title: In-ho Hyun: Innovator in Equipment Efficiency and Chip Scale Packaging
Introduction
In-ho Hyun is a notable inventor based in Suwon, South Korea. He has made significant contributions to the fields of equipment efficiency optimization and chip scale packaging. With a total of 2 patents, his work has had a considerable impact on manufacturing processes.
Latest Patents
In-ho Hyun's latest patents include a method, program storage device, and apparatus for optimizing and analyzing the efficiency of equipment. This innovative method dissects equipment running time into valuable operating time and various performance loss components. By simulating ideal equipment reference information that reflects dynamic manufacturing parameters, the method allows for a detailed analysis of operational performance loss. This analysis helps determine resource input priorities, incorporating parameters of a changing manufacturing environment to enhance equipment efficiency. His second patent details a method for fabricating chip scale packages (CSP). This process involves fabricating CSP chips on a wafer, conducting an electric die sorting process, and packaging non-defective chips into a CSP strip. The CSP strip undergoes final testing before being singulated into individual CSPs, which are then surface-mounted on a module board. This method significantly improves productivity and reduces manufacturing costs.
Career Highlights
In-ho Hyun is currently employed at Samsung Electronics Co., Ltd., where he continues to innovate and contribute to advancements in technology. His work has been instrumental in enhancing manufacturing processes and efficiency.
Collaborations
In his career, In-ho has collaborated with notable coworkers such as Ju-Seok Maeng and Sung-tae Kim. Their combined expertise has fostered a productive environment for innovation.
Conclusion
In-ho Hyun's contributions to equipment efficiency and chip scale packaging exemplify the spirit of innovation. His patents reflect a commitment to improving manufacturing processes and reducing costs. His work continues to influence the industry positively.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile