This inventor holds 2 USPTO granted patents and 1 published patent application. Top assignee: Samsung Electro-Mechanics Co., Ltd.. Active years: 2016-2017.
Location History:
- Gyunggi-do, KR (2016)
- Suwon-si, KR (2017)
Company Filing History:
Years Active: 2016-2017
Title: Il Hyeong Lee: Innovator in Semiconductor Technology
Introduction
Il Hyeong Lee is a prominent inventor based in Gyunggi-do, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His work focuses on enhancing the efficiency and integration of electronic components.
Latest Patents
One of his latest patents is for a semiconductor package. This innovative package includes a first substrate with a ground conductor, multiple electronic elements mounted on both surfaces, and a second substrate that accommodates these elements. Additionally, it features a molded portion that encapsulates the electronic elements and a shielding layer to protect against electromagnetic interference.
Another notable patent is for an electronic component module and its manufacturing method. This module increases integration by allowing electronic components to be mounted on both surfaces of a substrate. It consists of a first substrate with mounted electrodes, a second substrate bonded to it, and an insulating part that secures the two substrates together.
Career Highlights
Il Hyeong Lee is currently employed at Samsung Electro-Mechanics Co., Ltd., where he continues to innovate in the semiconductor field. His work has been instrumental in advancing the technology used in electronic devices.
Collaborations
He has collaborated with notable coworkers, including Seung Yong Choi and Jae Cheon Doh, contributing to various projects that enhance the capabilities of electronic components.
Conclusion
Il Hyeong Lee's contributions to semiconductor technology through his patents and work at Samsung Electro-Mechanics Co., Ltd. highlight his role as a key innovator in the industry. His advancements continue to shape the future of electronic components.