The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 29, 2016
Filed:
Oct. 07, 2013
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon, Gyunggi-do, KR;
Inventors:
Assignee:
Samsung Electro-Mechanics Co., Ltd., Suwon-si, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/14 (2006.01); H05K 3/36 (2006.01); H01L 23/00 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
H05K 3/368 (2013.01); H01L 24/97 (2013.01); H05K 1/144 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/19106 (2013.01); H05K 1/0298 (2013.01); H05K 1/181 (2013.01); H05K 3/284 (2013.01); H05K 2201/042 (2013.01); H05K 2201/09063 (2013.01); H05K 2203/1316 (2013.01); Y10T 29/49126 (2015.01);
Abstract
There is provided an electronic component module capable of increasing a degree of integration by mounting electronic component on both surfaces of a substrate, the module including: a first substrate having mounted electrodes formed on both surfaces thereof; a plurality of electronic components mounted on both surfaces of the first substrate; at least one second substrate bonded to a lower surface of the first substrate; and an insulating part formed in at least one position in a gap between the first substrate and the second substrate and bonding the first substrate to the second bonding substrate.