Ikushi Morizaki

Title: Ikushi Morizaki: Innovator in Semiconductor Technology

Introduction

Ikushi Morizaki is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of semiconductor technology, particularly in the development of advanced packaging methods. His innovative approach has led to the creation of a unique semiconductor packing stack module.

Latest Patents

Morizaki holds a patent for a semiconductor packing stack module and the method of producing the same. This invention involves mounting a large-scale integrated circuit (LSI) on a ceramic carrier substrate or a flexible carrier film using fine bumps. After injecting seal resin, the chip is thinned through grinding. Multiple carrier substrates or films are interconnected by bumps via through holes, resulting in a tridimensional stack module. This design achieves a miniature, thin, dense, low-cost, and reliable structure without the need for traditional wire bonding or tape automated bonding systems. Additionally, it minimizes wiring length and enhances electrical characteristics.

Career Highlights

Ikushi Morizaki is associated with NEC Corporation, where he has been instrumental in advancing semiconductor technologies. His work has garnered attention for its innovative solutions and practical applications in the industry.

Collaborations

Morizaki has collaborated with notable colleagues, including Naoji Senba and Yuzo Shimada. Their combined expertise has contributed to the success of various projects within the semiconductor field.

Conclusion

Ikushi Morizaki's contributions to semiconductor technology exemplify the spirit of innovation. His patented methods and collaborative efforts continue to influence the industry, paving the way for future advancements.