Ikuo Sugawara

Title: Ikuo Sugawara: Innovator in Multilayer Printed Circuit Board Technology

Introduction

Ikuo Sugawara is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of multilayer printed circuit boards, particularly through his innovative patent.

Latest Patents

Sugawara holds a patent for a resin film designed for interlayer insulating layers in multilayer printed circuit boards. This invention includes a support-attached resin film that features a resin composition layer formed on one side of the support. The support has particles that are exposed on the surface, with an average maximum height of exposed portions of the particles being 1.0 µm or less. Alternatively, the support may have no particles exposed on the surface. This technology enhances the performance and reliability of multilayer printed wiring boards.

Career Highlights

Ikuo Sugawara is associated with Showa Denko Materials Co., Ltd., where he has been instrumental in advancing the company's technological capabilities. His work has positioned him as a key figure in the development of innovative materials for electronic applications.

Collaborations

Sugawara collaborates with talented colleagues, including Takayuki Suzukawa and Tetsurou Irino. Their combined expertise fosters a creative environment that drives innovation in their projects.

Conclusion

Ikuo Sugawara's contributions to the field of multilayer printed circuit boards exemplify the impact of innovative thinking in technology. His patent reflects a commitment to enhancing electronic materials, showcasing the importance of collaboration and creativity in engineering advancements.