Location History:
- Maebashi, JP (2017)
- Kiryu, JP (2018)
Company Filing History:
2 out of 1,269 
2 out of 113 
Years Active: 2017-2018
Title: Ikuo Shohji: Innovator in Wiring Substrate Technology
Introduction
Ikuo Shohji is a notable inventor based in Kiryu, Japan. He has made significant contributions to the field of wiring substrate technology, holding a total of 2 patents. His work focuses on improving the manufacturing processes and materials used in electronic components.
Latest Patents
Shohji's latest patents include innovative designs for wiring substrates. One patent describes a wiring substrate for bonding using solder with a low melting point. This substrate features an electrode made of copper or a copper alloy, a plating film containing palladium, and a solder that bonds to the plating film when heated. The solder has a melting point lower than 140°C and contains dissolved palladium, eliminating the need for a palladium concentrated layer between the solder and the electrode. Another patent outlines a wiring substrate that includes an electrode of copper or a copper alloy, with a plated film consisting of an electroless nickel-plated layer and an electroless gold-plated layer. The electroless nickel-plated layer is formed through co-precipitation of nickel, phosphorus, bismuth, and sulfur, with specific content ratios that enhance its properties.
Career Highlights
Throughout his career, Ikuo Shohji has worked with prominent organizations such as Toppan Printing Co., Ltd. and Gunma University. His experience in these institutions has allowed him to develop and refine his innovative ideas in wiring substrate technology.
Collaborations
Shohji has collaborated with notable colleagues, including Tetsuyuki Tsuchida and Toshikazu Okubo. These partnerships have contributed to the advancement of his research and the successful development of his patents.
Conclusion
Ikuo Shohji's contributions to wiring substrate technology demonstrate his innovative spirit and dedication to improving electronic manufacturing processes. His patents reflect a commitment to advancing the field and enhancing the performance of electronic components.