The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 30, 2018
Filed:
Jul. 24, 2015
Applicants:
Toppan Printing Co. Ltd., Tokyo, JP;
National University Corporation Gunma University, Maebashi, JP;
Inventors:
Tetsuyuki Tsuchida, Tokyo, JP;
Toshikazu Okubo, Tokyo, JP;
Ikuo Shohji, Kiryu, JP;
Akihiro Hirata, Kiryu, JP;
Assignees:
TOPPAN PRINTING CO., LTD., Tokyo, JP;
NATIONAL UNIVERSITY CORPORATION GUNMA UNIVERSITY, Maebashi, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01); H05K 3/10 (2006.01); B23K 1/19 (2006.01); B23K 1/00 (2006.01); C25D 7/00 (2006.01); B23K 35/26 (2006.01); C22C 13/02 (2006.01); H05K 3/24 (2006.01); B23K 1/008 (2006.01);
U.S. Cl.
CPC ...
H05K 1/09 (2013.01); B23K 1/0008 (2013.01); B23K 1/008 (2013.01); B23K 1/0016 (2013.01); B23K 1/19 (2013.01); B23K 35/262 (2013.01); C22C 13/02 (2013.01); C25D 7/00 (2013.01); H05K 3/10 (2013.01); H05K 3/244 (2013.01); H01L 2924/0002 (2013.01); H05K 2201/0341 (2013.01); H05K 2203/043 (2013.01);
Abstract
There is provided a wiring substrate including an electrode including Cu or a Cu alloy, a plating film having a film including at least Pd, formed on the electrode, and a solder which is bonded onto the plating film by heating, has a melting point of lower than 140° C., and includes Pd dissolved therein, a Pd concentrated layer being absent between the solder and the electrode.