Toppan Printing Co., Ltd.

Gunma University

Ikuo Shohji

Tetsuyuki Tsuchida

Toshikazu Okubo

Akihiro Hirata

Takahiro Kano

There is provided a wiring substrate including an electrode including Cu or a Cu alloy, a plating film having a film including at least Pd, formed on the electrode, and a solder which is bonded onto the plating film by heating, has a melting point of lower than 140&#xb0; C., and includes Pd dissolved therein, a Pd concentrated layer being absent between the solder and the electrode.

Wiring substrate for bonding using solder having a low melting point and method for manufacturing same

A wiring substrate includes an electrode including Cu or a Cu alloy, and a plated film including an electroless nickel-plated layer formed on the electrode and an electroless gold-plated layer formed on the electroless nickel-plated layer. The electroless nickel-plated layer is formed by co-precipitation of Ni, P, Bi, and S, the electroless nickel-plated layer includes a content of P of 5% by mass or more and less than 10% by mass, a content of Bi of 1 ppm by mass to 1,000 ppm by mass, and a content of S of 1 ppm by mass to 2,000 ppm by mass, and a mass ratio of the content of S to the content of Bi (S/Bi) is more than 1.0.

Growing community of inventors

Kiryu, Japan

Ikuo Shohji