This inventor holds 9 USPTO granted patents and 6 published patent applications and 1 EPO patent. Top assignee: Ngk Insulators, Inc.. Active years: 2004-2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2004-2026
Title: Ikuhisa Morioka: Innovator in Wafer Technology
Introduction
Ikuhisa Morioka is a prominent inventor based in Handa, Japan. He has made significant contributions to the field of semiconductor technology, particularly in the design and development of wafer placement systems. With a total of 9 patents to his name, Morioka's work has had a substantial impact on the industry.
Latest Patents
Morioka's latest patents include innovative designs such as a wafer placement table and an electrostatic chuck assembly. The wafer placement table features a ceramic plate with a wafer placement surface, an electrically conductive plate, and a gas intermediate passage. This design enhances the efficiency of wafer handling in semiconductor manufacturing. Additionally, his electrostatic chuck assembly includes a ceramic body with embedded electrodes and a focus ring, which improves the attraction and stability of wafers during processing.
Career Highlights
Morioka is currently employed at NGK Insulators, Inc., where he continues to push the boundaries of wafer technology. His expertise in the field has led to numerous advancements that benefit the semiconductor industry. His innovative designs are recognized for their practicality and effectiveness in enhancing manufacturing processes.
Collaborations
Morioka has collaborated with notable colleagues such as Hideyoshi Tsuruta and Tatsuya Kuno. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies in wafer processing.
Conclusion
Ikuhisa Morioka's contributions to wafer technology exemplify his dedication to innovation and excellence in the semiconductor industry. His patents and collaborative efforts continue to shape the future of wafer handling and processing.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
