Handa, Japan

Ikuhisa Morioka

This inventor holds 9 USPTO granted patents and 6 published patent applications and 1 EPO patent. Top assignee: Ngk Insulators, Inc.. Active years: 2004-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ikuhisa Morioka. Retrieved from https://idiyas.com/inventor/ikuhisa-morioka

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 9 

% Patents Active = 100.0


Average Co-Inventor Count = 3.4

ph-index = 3

Forward Citations = 27(Granted Patents)


Company Filing History:


Years Active: 2004-2026

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9 patents (USPTO):Explore Patents

Title: Ikuhisa Morioka: Innovator in Wafer Technology

Introduction

Ikuhisa Morioka is a prominent inventor based in Handa, Japan. He has made significant contributions to the field of semiconductor technology, particularly in the design and development of wafer placement systems. With a total of 9 patents to his name, Morioka's work has had a substantial impact on the industry.

Latest Patents

Morioka's latest patents include innovative designs such as a wafer placement table and an electrostatic chuck assembly. The wafer placement table features a ceramic plate with a wafer placement surface, an electrically conductive plate, and a gas intermediate passage. This design enhances the efficiency of wafer handling in semiconductor manufacturing. Additionally, his electrostatic chuck assembly includes a ceramic body with embedded electrodes and a focus ring, which improves the attraction and stability of wafers during processing.

Career Highlights

Morioka is currently employed at NGK Insulators, Inc., where he continues to push the boundaries of wafer technology. His expertise in the field has led to numerous advancements that benefit the semiconductor industry. His innovative designs are recognized for their practicality and effectiveness in enhancing manufacturing processes.

Collaborations

Morioka has collaborated with notable colleagues such as Hideyoshi Tsuruta and Tatsuya Kuno. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies in wafer processing.

Conclusion

Ikuhisa Morioka's contributions to wafer technology exemplify his dedication to innovation and excellence in the semiconductor industry. His patents and collaborative efforts continue to shape the future of wafer handling and processing.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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