Ikio Sugiura

Title: Ikio Sugiura: Innovator in Semiconductor Packaging

Introduction

Ikio Sugiura is a prominent inventor based in Tokyo, Japan. He is known for his contributions to the field of semiconductor packaging. His innovative approach has led to the development of a unique manufacturing method that enhances the efficiency and reliability of semiconductor packages.

Latest Patents

Ikio Sugiura holds a patent for a manufacturing method of semiconductor packages. This method involves the formation of a plating layer on through holes in semiconductor packages. The process includes stacking first and second bodies with cavities facing inward, bonding them with adhesive, and ensuring that the through holes are designed to retain part of the stacked bodies. The through holes are then plated to create the plating layer, followed by the removal of peripheral regions and division into multiple semiconductor packages along dicing lines.

Career Highlights

Sugiura is associated with Mitsubishi Electric Corporation, where he has made significant contributions to semiconductor technology. His work has been instrumental in advancing the manufacturing processes used in the industry. His innovative methods have not only improved product quality but also streamlined production efficiency.

Collaborations

Ikio Sugiura has collaborated with notable colleagues such as Masanori Nimura and Shigenori Takeda. These collaborations have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Ikio Sugiura's contributions to semiconductor packaging exemplify the spirit of innovation in technology. His patent and work at Mitsubishi Electric Corporation highlight his role as a key figure in advancing semiconductor manufacturing methods.