Mitsubishi Electric Corporation

Ikio Sugiura

Yoshinao Tatei

Takashi Okamuro

Hiroo Sakamoto

Masanori Nimura

Tsuneo Hamaguchi

Shigenori Takeda

Takashi Shirase

Masaki Iwata

When a plating layer is formed on through holes in semiconductor packages, first and second stacked bodies are stacked with first and second cavities formed in the first and second stacked bodies facing the inner side and are bonded together by applying adhesive to peripheral regions so that the cavities of the first and second stacked bodies form sealed spaces, and the through holes are formed such that part of the first and second stacked bodies including the bonding surface remains. Then, the through holes are plated to form the plating layer, the peripheral regions are removed as cutting allowances, i.e., removal regions, and the first and second stacked bodies are divided into a plurality of pieces along dicing lines to form semiconductor packages.

Manufacturing method of semiconductor package

Growing community of inventors

Tokyo, Japan

Ikio Sugiura