San Francisco, CA, United States of America

Ik Soo Kwon

This inventor holds 2 USPTO granted patents. Top assignee: Neuralink, Corp.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ik Soo Kwon. Retrieved from https://idiyas.com/inventor/ik-soo-kwon

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 10.0

ph-index = 1


Company Filing History:


Years Active: 2026

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2 patents (USPTO):Explore Patents

Title: Ik Soo Kwon and an Implantable Device Enclosure Innovation.

Introduction

Ik Soo Kwon is an inventor based in San Francisco, California, and is associated with Neuralink, Corp. His patent work addresses a materials and sealing challenge in implantable medical devices: creating a substantially hermetic enclosure while allowing closely spaced insulated wires to pass through it.

Latest Patents

Kwon is credited with 1 patent: “Polychlorotrifluoroethylene (PCTFE) Polymer Enclosure for an Implantable Device.” The invention describes an enclosure made from two PCTFE portions configured to mate, with parallel insulated wires extending between them. The wires are spaced less than 150 micrometers apart. A thermal weld seam conforms around the insulation of each wire, joining the enclosure portions and helping seal the device.

Career Highlights

Kwon’s listed patent highlights an approach to packaging implantable electronics using PCTFE and a conformal thermal weld. The design focuses on maintaining a sealed enclosure despite the presence of multiple closely spaced wire connections.

Collaborations

Kwon is associated with Neuralink, Corp. His listed coworkers include John Wf To and Dongjin Seo.

Conclusion

Ik Soo Kwon’s patent describes a PCTFE enclosure designed to combine closely spaced wire connections with a substantially hermetic seal for an implantable device.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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