The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 27, 2026

Filed:

Nov. 17, 2021
Applicant:

Neuralink Corp., Fremont, CA (US);

Inventors:

Ik Soo Kwon, San Francisco, CA (US);

Dongjin Seo, San Francisco, CA (US);

John W.F. To, Castro Valley, CA (US);

Assignee:

Neuralink Corp., Fremont, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61B 5/00 (2006.01); A61B 5/293 (2021.01); A61N 1/375 (2006.01); H01B 3/30 (2006.01); H01B 7/04 (2006.01); H01B 13/22 (2006.01); G06F 3/01 (2006.01);
U.S. Cl.
CPC ...
A61B 5/6868 (2013.01); A61B 5/293 (2021.01); A61N 1/3754 (2013.01); H01B 3/306 (2013.01); H01B 7/048 (2013.01); H01B 13/22 (2013.01); A61B 2562/0209 (2013.01); A61B 2562/125 (2013.01); G06F 3/015 (2013.01);
Abstract

An implantable device and method of manufacture include a substantially hermetic polychlorotrifluoroethylene (PCTFE) enclosure with closely-spaced wires extending through a slit in the enclosure. A method for manufacturing the implantable device includes cutting a slit in a piece of polymer and extending a plurality of insulated wires through the slit. Each of the insulated wires are parallel to a neighboring wire of the insulated wires. The piece of polymer is thermally bonded around each wire of the plurality of insulated wires such that the piece of polymer is sealed around insulation of each wire with a portion of each wire extending through the piece of polymer.


Find Patent Forward Citations

Quick Actions:

Kwon, Ik. (2026). Polymer enclosure with wire passthrough for implantable device (U.S. Patent No. 12773167). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12773167

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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