This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: Jabil Inc.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Idris Bin Mansor: Inventor in Printed Circuit Board Assembly
Introduction
Idris Bin Mansor is an inventor based in Penang, Malaysia, and works at Jabil Inc. His patent work addresses methods for stacking printed circuit board assemblies while reducing potential effects on component and solder-joint reliability.
Latest Patents
Mansor is named on one patent: “Method and Apparatus for Stacking Printed Circuit Board Assemblies with Single Reflow.” The disclosed methods and devices enable printed circuit board assemblies to be stacked using a single reflow process, with the aim of decreasing the impact on surface mount technology components and solder-joint reliability. The patent record provided identifies 1 patent.
Career Highlights
Mansor’s identified invention focuses on a manufacturing process for printed circuit board assemblies. His work at Jabil Inc. connects this patent to the company’s electronics manufacturing activities.
Collaborations
Mansor’s listed coworker is Zambri Bin Samsudin. The information provided does not specify their roles or the nature of their collaboration.
Conclusion
Idris Bin Mansor’s patent highlights an approach to stacking printed circuit board assemblies through a single reflow process, with attention to component and solder-joint reliability.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile