The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 16, 2026
Filed:
Sep. 13, 2021
Applicant:
Jabil Inc., St. Petersburg, FL (US);
Inventors:
Zambri Bin Samsudin, Penang, MY;
Idris Bin Mansor, Penang, MY;
Assignee:
Jabil Inc., St. Petersburg, FL (US);
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/341 (2026.01); H05K 3/12 (2006.01); H05K 3/3494 (2026.01); H05K 13/08 (2006.01);
U.S. Cl.
CPC ...
H05K 3/341 (2013.01); H05K 3/1225 (2013.01); H05K 3/3494 (2013.01); H05K 13/085 (2018.08);
Abstract
Disclosed herein are implementations of methods and devices for stacking printed circuit board (PCB) assemblies (PCBA) with a single reflow process which decreases impact on surface mount technology (SMT) component and solder joint reliability.
Samsudin, Zambri. (2026). Method and apparatus for stacking printed circuit board assemblies with single reflow (U.S. Patent No. 12660094). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12660094
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile