Company Filing History:
Years Active: 2006
Title: Ichiroh Sawamura: Innovator in Electrolytic Copper Plating
Introduction
Ichiroh Sawamura is a notable inventor based in Ibaraki, Japan. He has made significant contributions to the field of electroplating, particularly in the development of methods that enhance the quality and efficiency of semiconductor manufacturing. His innovative approach has led to advancements that are crucial for modern electronics.
Latest Patents
Ichiroh Sawamura holds a patent for an electrolytic copper plating method, which includes a phosphorous copper anode designed for electrolytic plating. This method is characterized by its ability to suppress the generation of particles, such as sludge, produced on the anode side within the plating bath. The patent details the specific conditions under which the phosphorous copper anode operates effectively, including the crystal grain size and anode current density. This innovation is particularly beneficial for preventing particle adhesion to semiconductor wafers, thereby improving the overall quality of the final product. He has 1 patent related to this technology.
Career Highlights
Ichiroh Sawamura is associated with Nippon Mining & Metals Co., Ltd., where he has been instrumental in advancing the company's capabilities in electroplating technologies. His work has not only contributed to the company's success but has also positioned it as a leader in the semiconductor materials sector.
Collaborations
Throughout his career, Ichiroh has collaborated with esteemed colleagues, including Takeo Okabe and Akihiro Aiba. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.
Conclusion
Ichiroh Sawamura's contributions to the field of electrolytic copper plating have made a significant impact on semiconductor manufacturing. His innovative methods and collaborative efforts continue to drive advancements in technology.