Wake Forest, NC, United States of America

Ian Currier

USPTO Granted Patents = 4 

 

Average Co-Inventor Count = 4.0

ph-index = 4

Forward Citations = 30(Granted Patents)


Company Filing History:


Years Active: 2020-2024

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4 patents (USPTO):Explore Patents

Title: Ian Currier: Innovator in Silicon Carbide Technology

Introduction

Ian Currier is a notable inventor based in Wake Forest, NC (US), recognized for his contributions to the field of silicon carbide (SiC) technology. With a total of four patents to his name, Currier has made significant advancements that address manufacturing challenges in the semiconductor industry.

Latest Patents

One of Currier's latest patents focuses on silicon carbide wafers with a relaxed positive bow and related methods. This innovation includes intentional or imposed wafer shapes designed to minimize manufacturing issues such as deformation, bowing, or sagging of SiC wafers. These problems often arise due to gravitational forces or preexisting crystal stress. By employing a relaxed positive bow from the silicon faces of the wafers, Currier's methods aim to reduce the adverse effects associated with these manufacturing challenges. Additionally, the related methods provide reduced kerf losses of bulk crystalline material, which may involve laser-assisted separation techniques for SiC wafers.

Career Highlights

Throughout his career, Ian Currier has worked with prominent companies in the semiconductor industry, including Cree GmbH and Wolfspeed, Inc. His experience in these organizations has allowed him to develop and refine his innovative approaches to silicon carbide technology.

Collaborations

Currier has collaborated with talented individuals in his field, including Simon Bubel and Matthew Donofrio. These partnerships have contributed to the advancement of his research and the successful development of his patented technologies.

Conclusion

Ian Currier's work in silicon carbide technology exemplifies the spirit of innovation in the semiconductor industry. His patents and collaborations reflect a commitment to overcoming manufacturing challenges and advancing the capabilities of SiC wafers.

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