This inventor holds 2 USPTO granted patents. Top assignee: Kulicke and Soffa Industries, Inc.. Active years: 1985-1986.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 1985-1986
Title: Innovations by I Marvin Weilerstein
Introduction
I Marvin Weilerstein is a notable inventor based in Philadelphia, PA (US). He has made significant contributions to the field of semiconductor technology, particularly in the area of wire bonding. With a total of 2 patents, his work has advanced the methods used in electronic component manufacturing.
Latest Patents
Weilerstein's latest patents include a wire bond monitoring system and an apparatus for detecting missing wires. The wire bond monitoring system provides a method for monitoring conditions of a fine wire interconnection during a bonding operation. This apparatus can be installed on new automatic wire bonders or retrofitted into existing ones. It employs a main bonding processor to control the motion of the bonding tool, ensuring that the bonding process does not damage the semiconductor device.
The second patent, an apparatus for detecting missing wires, monitors the bond condition of a fine aluminum wire being ultrasonically bonded to an electrode pad. This system generates signals indicative of the bonding cycles and utilizes a microprocessor to calculate a bond quality rating. This rating accurately predicts whether a good bond has been made, enhancing the reliability of the bonding process.
Career Highlights
Weilerstein is currently associated with Kulicke and Soffa Industries, Inc., a company known for its innovations in semiconductor packaging and assembly. His work has been instrumental in improving the efficiency and quality of wire bonding processes in the industry.
Collaborations
Throughout his career, Weilerstein has collaborated with notable colleagues such as John D Dreibelbis and Michael McBrearty. These collaborations have contributed to the advancement of technology in the field of semiconductor manufacturing.
Conclusion
I Marvin Weilerstein's contributions to wire bonding technology have made a significant impact on the semiconductor industry. His innovative patents and collaborations reflect his commitment to advancing electronic manufacturing processes.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile