The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 17, 1985

Filed:

Oct. 24, 1983
Applicant:
Inventors:

Michael McBrearty, Philadelphia, PA (US);

Michael Negin, Cinnaminson, NJ (US);

I Marvin Weilerstein, Philadelphia, PA (US);

Albert J Zielenski, Philadelphia, PA (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01M / ; B23K / ;
U.S. Cl.
CPC ...
73588 ; 228-11 ; 228-45 ; 228 10 ;
Abstract

Apparatus is provided for monitoring the bond condition of a fine aluminum wire being ultrasonically bonded to an electrode pad. The apparatus comprises a counter for generating a start and stop signal indicative of a predetermined plurality of cycles from the ultrasonic generator of the ultrasonic bonder. A stable source of pulses is applied to a second counter which is started and stopped by the start and stop signal. The count stored in the second counter is read out to a microprocessor and is indicative of the frequency of the ultrasonic generator during the bonding operation. A plurality of frequency readings are taken and measured during the formation of an ultrasonic wedge bond and this information is employed to calculate a bond quality rating which accurately predicts whether a good bond has been made or some condition exists indicating that a good bond has not been made.


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