Taoyuan, Taiwan

I Hsuan Wei

This inventor holds 1 USPTO granted patent. Top assignee: Powerchip Semiconductor Manufacturing Corporation. Active years: 2026.


% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: I Hsuan Wei: Innovator in Semiconductor Technology

Introduction

I Hsuan Wei is a prominent inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly through his innovative designs and structures.

Latest Patents

I Hsuan Wei holds a patent for a semiconductor structure that includes a substrate and a capacitor structure. This capacitor structure is positioned above the substrate and consists of a first electrode layer, a second electrode layer, and a first dielectric layer. The second electrode layer is placed on the first electrode layer, while the first dielectric layer, which is a composite dielectric layer, is situated between the two electrode layers. This composite dielectric layer includes at least one first silicon nitride layer and at least one first high-k dielectric layer. He has 1 patent to his name.

Career Highlights

I Hsuan Wei is associated with Powerchip Semiconductor Manufacturing Corporation, where he has been instrumental in advancing semiconductor technologies. His work has contributed to the development of more efficient and effective semiconductor structures.

Collaborations

I Hsuan Wei has collaborated with notable professionals in the field, including Michio Sakurai and Shou-Zen Chang. These collaborations have further enhanced his contributions to semiconductor technology.

Conclusion

I Hsuan Wei's innovative work in semiconductor structures showcases his expertise and commitment to advancing technology in this critical field. His contributions are significant and continue to influence the industry.

Profile summary based on public USPTO records.
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