I-Heng Chou

Title: I-Heng Chou: Innovator in Microelectromechanical Systems

Introduction

I-Heng Chou is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of microelectromechanical systems (MEMS). His innovative work has led to the development of a patented MEMS device that showcases his expertise and creativity.

Latest Patents

I-Heng Chou holds a patent for a microelectromechanical system device. This device includes a processing die, a MEMS die, and a plurality of wires. The MEMS die consists of a substrate and a MEMS element. The substrate features a first surface that includes a circuit and several first conductive contacts connected to the circuit. The MEMS element has a second surface, a third surface, and at least one second conductive contact. The MEMS element is positioned on the first surface of the substrate, with the second surface facing the substrate. The wires serve to electrically connect the substrate and the MEMS element of the MEMS die to the processing die through the first and second conductive contacts, respectively. I-Heng Chou has 1 patent to his name.

Career Highlights

I-Heng Chou is currently associated with Miramems Sensing Technology Co., Ltd. His role in the company allows him to further explore and develop innovative MEMS technologies. His work has been instrumental in advancing the capabilities of MEMS devices in various applications.

Collaborations

I-Heng Chou has collaborated with notable colleagues, including Li-Tien Tseng and Chih-Liang Kuo. These collaborations have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

I-Heng Chou is a distinguished inventor whose work in microelectromechanical systems has made a significant impact in the field. His patent and collaborations reflect his commitment to innovation and excellence.