The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 23, 2019

Filed:

Jan. 23, 2018
Applicant:

Miramems Sensing Technology Co., Ltd, Suzhou, CN;

Inventors:

I-Heng Chou, Hsinchu, TW;

Li-Tien Tseng, Taoyuan, TW;

Chih-Liang Kuo, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B81B 7/00 (2006.01); B81B 3/00 (2006.01); B81C 1/00 (2006.01);
U.S. Cl.
CPC ...
B81B 7/0006 (2013.01); B81B 3/0018 (2013.01); B81B 3/0021 (2013.01); B81B 7/0032 (2013.01); B81C 1/0015 (2013.01); B81C 1/0023 (2013.01); B81C 1/00134 (2013.01); B81C 1/00158 (2013.01); B81C 1/00182 (2013.01); B81B 2201/0264 (2013.01); B81C 2203/0792 (2013.01);
Abstract

A microelectromechanical system (MEMS) device includes a processing die, a MEMS die and a plurality of wires. The MEMS die includes a substrate and a MEMS element. The substrate has a first surface, and the first surface includes a circuit and a plurality of first conductive contacts electrically connected with the circuit. The MEMS element has a second surface, a third surface and at least one second conductive contact, wherein the MEMS element is disposed on the first surface of the substrate with the second surface facing the substrate, and the at least one second conductive contact is disposed on the third surface of the MEMS element. The wires electrically connect the substrate and the MEMS element of the MEMS die to the processing die through the first conductive contacts and the second conductive contact respectively.


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