I-Chia H Chang

Title: I-Chia H Chang: Innovator in Electroplating Solutions

Introduction

I-Chia H Chang is a notable inventor based in Peekskill, NY (US). He has made significant contributions to the field of electroplating, holding a total of 3 patents. His work focuses on developing advanced solutions and processes that enhance the efficiency and effectiveness of electroplating techniques.

Latest Patents

Chang's latest patents include an innovative acidic electrolytic solution designed for the electrodeposition of copper-rich alloys. This solution incorporates a first salt containing copper cations and a second salt with cations of a less noble metal. The process allows for the underpotential deposition of the less noble metal on copper, utilizing an acid electrolyte such as methane sulfonic acid. Additionally, he has developed a method for analyzing addition agents in electroplating solutions. This method involves measuring concentrations of additives in PbSn plating solutions through a series of precise steps, including the use of pulse voltammetry techniques.

Career Highlights

I-Chia H Chang is currently employed at International Business Machines Corporation (IBM). His role at IBM allows him to apply his expertise in electroplating and contribute to the company's innovative projects. His work has been instrumental in advancing the technology used in various applications.

Collaborations

Chang has collaborated with notable colleagues, including Wilma Jean Horkans and Panayotis Constantinou Andricacos. These collaborations have fostered a productive environment for innovation and development in their respective fields.

Conclusion

I-Chia H Chang is a distinguished inventor whose work in electroplating solutions has made a significant impact on the industry. His patents reflect a commitment to advancing technology and improving processes in electroplating.