I-Che Chiu

Title: I-Che Chiu and Semiconductor Wafer Cooling

Introduction

I-Che Chiu is an inventor associated with Taoyuan, Taiwan. His listed patent work concerns cooling semiconductor wafers during processing. He is associated with Taiwan Semiconductor Manufacturing Company, Ltd.

Latest Patents

Chiu is credited with 1 patent: “Method and Apparatus for Wafer Backside Cooling.” The invention describes placing a semiconductor wafer on a wafer chuck and performing a process over the wafer while supplying cooling gas to its backside. The gas flows through a groove and ventilation apertures in the groove. Neighboring apertures are spaced around the chuck’s center by a predetermined angle of less than 90 degrees.

Career Highlights

The available information connects Chiu’s inventive work with semiconductor manufacturing and wafer-processing technology. His patent addresses backside cooling, a method intended to manage wafer temperature during processing.

Collaborations

Chiu’s listed coworkers include Young-Shuen Chou and Chung-Hsiu Cheng. The provided information does not specify their roles in the patent or their particular contributions.

Conclusion

I-Che Chiu’s listed patent focuses on a wafer backside-cooling method that supplies gas through a groove and closely spaced ventilation apertures, reflecting his connection to semiconductor process technology.