This inventor holds 1 USPTO granted patent. Top assignee: Stats Chippac Pte. Ltd.. Active years: 2012.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2012
Title: HyunSoo Shin: Innovator in Flip-Chip Technology
Introduction
HyunSoo Shin is a notable inventor based in Kyoungki-do, South Korea. He has made significant contributions to the field of semiconductor technology, particularly in the area of flip-chip ball grid arrays. His innovative methods have the potential to enhance the performance and reliability of electronic devices.
Latest Patents
HyunSoo Shin holds a patent for "Methods for manufacturing thermally enhanced flip-chip ball grid arrays." This patent outlines a method for fabricating flip-chips, where a flip-chip is mounted active-surface downward onto a substrate. The process involves applying adhesive to selected regions, placing a heat-spreader, and filling a gap with thermal-insulating material. This method significantly reduces the risk of die damage during the attachment of heat-spreaders.
Career Highlights
HyunSoo Shin is currently employed at Stats Chippac Pte. Ltd., where he continues to develop innovative solutions in semiconductor manufacturing. His work has been instrumental in advancing the technology used in modern electronic devices.
Collaborations
He has collaborated with notable colleagues, including KyungOe Kim and YoungJoon Kim, contributing to various projects that enhance the capabilities of flip-chip technology.
Conclusion
HyunSoo Shin's contributions to the field of semiconductor technology, particularly through his patented methods, demonstrate his commitment to innovation and excellence. His work continues to influence the development of reliable electronic devices.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile