Company Filing History:
Years Active: 2022-2025
Title: Hyunseok Park: Innovator in Semiconductor Technology
Introduction
Hyunseok Park is a notable inventor based in Gyeonggi-do, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His work focuses on enhancing electrical conductivity and interconnectivity in semiconductor devices.
Latest Patents
One of his latest patents is a semiconductor device and method of forming RDL with a graphene-coated core. This invention features a one-layer interconnect substrate with electrical components placed over its surface. The RDL incorporates a graphene core shell, which consists of a copper core coated with graphene, providing an efficient electrical path. This technology is particularly useful for improving electrical conductivity within a System in Package (SIP).
Another significant patent by Hyunseok Park is a semiconductor device and method of forming a graphene-coated core embedded within Thermal Interface Material (TIM). This invention involves a substrate with an electrical component and a TIM that has a core covered by graphene. The TIM is designed to enhance thermal conductivity, ensuring efficient heat dissipation from the electrical component.
Career Highlights
Hyunseok Park has worked with prominent companies in the semiconductor industry, including Stats Chippac Pte. Ltd. and Samsung Electronics Co., Ltd. His experience in these organizations has contributed to his expertise in semiconductor technologies and innovations.
Collaborations
Throughout his career, Hyunseok Park has collaborated with talented individuals such as YongMoo Shin and Choongsun Shim. These collaborations have likely fostered innovative ideas and advancements in semiconductor technology.
Conclusion
Hyunseok Park is a distinguished inventor whose work in semiconductor technology has led to valuable patents that enhance electrical and thermal performance in devices. His contributions continue to influence the industry and pave the way for future innovations.