Stats Chippac Pte. Ltd.

Samsung Electronics Co., Ltd.

Hyunseok Park

YongMoo Shin

Kyungmin Lee

HeeSoo Lee

Kyowang Koo

Sangmoo Hwangbo

Kyungwoo Lim

Cheolyoon Chung

Hyunseok Seo

Choongsun Shim

Sinjae Kim

A semiconductor device has a one-layer interconnect substrate and electrical component disposed over a first surface of the interconnect substrate. The electrical components can be discrete electrical devices, IPDs, semiconductor die, semiconductor packages, surface mount devices, and RF components. An RDL with a graphene core shell is formed over a second surface of the interconnect substrate. The graphene core shell has a copper core and a graphene coating formed over the copper core. The RDL further has a matrix to embed the graphene core shell. The graphene core shells through RDL form an electrical path. The RDL can be thermoset material or polymer or composite epoxy type matrix. The graphene core shell is embedded within the thermoset material or polymer or composite epoxy type matrix. The RDL with graphene core shell is useful for electrical conductivity and electrical interconnect within an SIP.

Semiconductor device and method of forming RDL with graphene-coated core

A semiconductor device has a substrate and electrical component disposed over the substrate. The electrical component can be a semiconductor die, semiconductor package, surface mount device, RF component, discrete electrical device, or IPD. A TIM is deposited over the electrical component. The TIM has a core, such as Cu, covered by graphene. A heat sink is disposed over the TIM, electrical component, and substrate. The TIM is printed on the electrical component. The graphene is interconnected within the TIM to form a thermal path from a first surface of the TIM to a second surface of the TIM opposite the first surface of the TIM. The TIM has thermoset material or soldering type matrix and the core covered by graphene is embedded within the thermoset material or soldering type matrix. A metal layer can be formed between the TIM and electrical component.

Semiconductor device and method of forming graphene-coated core embedded within TIM

Various embodiments relate to an electronic device and a method for outputting an alert, and a system comprising a locking device coupled to the electronic device. To this end, the electronic device, according to various embodiments, comprises: a connection terminal; and a processor, wherein the processor is configured to: detect a connection with a locking device via the connection terminal; receive an identifier of the locking device from the locking device; identify the received identifier to set the electronic device in an alert mode; detect a disconnection between the electronic device and the locking device; and output an alert in response to the detected disconnection. Other embodiments may be possible.

Electronic device and method for outputting alert, and system comprising locking device coupled to electronic device

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Gyeonggi-do, South Korea

Hyunseok Park