Hyunll Bae

Title: Hyunll Bae: Innovator in Integrated Circuit Packaging

Introduction

Hyunll Bae is a prominent inventor based in Seoul, South Korea. He has made significant contributions to the field of integrated circuit technology. His innovative work has led to the development of a unique patent that enhances the efficiency of circuit packaging.

Latest Patents

Hyunll Bae holds a patent for an "Integrated circuit packaging system with surface treatment and method of manufacture thereof." This invention includes an embedded trace substrate with bonding sites and traces embedded in a base material. The system features an insulation layer on the traces, which has a top surface coplanar with the top surface of the base material. Additionally, an integrated circuit die is connected to the bonding sites. This patent showcases his expertise in creating advanced packaging solutions for integrated circuits. He has 1 patent to his name.

Career Highlights

Hyunll Bae is currently employed at Stats Chippac Pte. Ltd., a company known for its innovative semiconductor packaging solutions. His role at the company allows him to further develop his ideas and contribute to cutting-edge technology in the industry.

Collaborations

Throughout his career, Hyunll Bae has collaborated with talented individuals such as Hun Teak Lee and YoungChul Kim. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Hyunll Bae is a notable inventor whose work in integrated circuit packaging has made a significant impact in the field. His patent reflects his commitment to advancing technology and improving manufacturing processes.