HyunJin Song

Title: Innovations by HyunJin Song

Introduction

HyunJin Song is a notable inventor based in Kyunggi-do, South Korea. He has made significant contributions to the field of semiconductor technology. With a focus on innovative designs and methods, he has secured a total of 2 patents that showcase his expertise and creativity.

Latest Patents

One of HyunJin Song's latest patents is a semiconductor device and method of forming a Wafer-Level Chip-Scale Package (WLCSP) with a semiconductor die embedded within an interconnect structure. This invention includes a semiconductor die that is encapsulated and features an insulating layer formed over it. A semiconductor component is placed over this insulating layer, and a first interconnect structure is created to embed the semiconductor component. Additionally, a conductive via is formed in the semiconductor die, along with a heat sink positioned above it. The design also incorporates a second interconnect structure and a conductive layer over the semiconductor component, with an opening in the insulating layer to enhance functionality.

Career Highlights

HyunJin Song is currently employed at Stats Chippac Pte. Ltd., where he continues to innovate in the semiconductor industry. His work has been instrumental in advancing semiconductor device technology, contributing to the efficiency and performance of electronic components.

Collaborations

Throughout his career, HyunJin has collaborated with talented individuals such as KyungHoon Lee and Kyoungll Huh. These collaborations have fostered a creative environment that encourages the development of groundbreaking technologies.

Conclusion

HyunJin Song's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor in the field. His innovative approaches continue to shape the future of electronic devices.