Cheongju-si, South Korea

Hyung-yong Kim

USPTO Granted Patents = 7 

Average Co-Inventor Count = 5.8

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:


Years Active: 2013-2022

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7 patents (USPTO):

Title: The Innovations of Hyung-yong Kim

Introduction

Hyung-yong Kim is a prominent inventor based in Cheongju-si, South Korea. He has made significant contributions to the field of image sensor technology, holding a total of 7 patents. His work focuses on enhancing the capabilities and manufacturing processes of three-dimensional image sensors.

Latest Patents

One of Hyung-yong Kim's latest patents is a three-dimensional image sensor based on structured light. This inventive concept aims to reduce the difficulty in the manufacturing process of a wiring layer while increasing the area of a bottom pad of a capacitor. The 3D image sensor features a pixel area that includes a photodiode in a semiconductor substrate and a gate group with multiple gates. Additionally, it incorporates a multiple wiring layer above the pixel area, consisting of at least two wiring layers. The capacitor structure is situated between the first wiring layer on the lowermost wiring layer and the second wiring layer on the first wiring layer. This structure includes a bottom pad, a top pad, and several capacitors, with the bottom pad connected to the first wiring layer.

Career Highlights

Hyung-yong Kim is currently employed at Samsung Electronics Co., Ltd., where he continues to innovate in the field of image sensors. His work has been instrumental in advancing the technology used in various electronic devices.

Collaborations

Throughout his career, Hyung-yong Kim has collaborated with notable colleagues, including Myeong-Cheol Kim and Gang Zhang. These collaborations have further enriched his contributions to the field.

Conclusion

Hyung-yong Kim's innovative work in three-dimensional image sensors showcases his expertise and commitment to advancing technology. His patents reflect a deep understanding of the complexities involved in sensor design and manufacturing.

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