This inventor holds 3 USPTO granted patents and 1 published patent application. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2009-2010.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Location History:
- Seoul, KR (2009)
- Gyeonggi-do, KR (2009 - 2010)
Company Filing History:
Years Active: 2009-2010
Title: Innovations of Hyung-Lae Eun in Semiconductor Technology
Introduction
Hyung-Lae Eun is a notable inventor based in Gyeonggi-do, South Korea. He has made significant contributions to the field of semiconductor technology, holding three patents that showcase his innovative spirit and technical expertise. His work primarily focuses on semiconductor device packages, which are crucial for modern electronic devices.
Latest Patents
Hyung-Lae Eun's latest patents include a semiconductor device package and a stacked-type semiconductor device package. The semiconductor device package features stacked semiconductor chips with bonding pads, mounted on a printed circuit board (PCB). This design includes bonding electrodes that correspond to the bonding pads and interposers that cover the stacked chips, facilitating connections through wire patterns. The stacked-type semiconductor device package consists of multiple stacked semiconductor chip packages with exposed joining electrodes and a flexible printed circuit board (flexible PCB) that connects these packages. The flexible PCB is designed to cover the sides of the stacked packages, ensuring efficient connectivity.
Career Highlights
Hyung-Lae Eun is currently employed at Samsung Electronics Co., Ltd., a leading company in the electronics industry. His role at Samsung allows him to work on cutting-edge technologies and contribute to the development of advanced semiconductor solutions. His patents reflect his commitment to innovation and excellence in his field.
Collaborations
Hyung-Lae Eun collaborates with talented coworkers, including Byung-Jo Kim and Sang-Jib Han. Their combined expertise fosters a creative environment that drives technological advancements in semiconductor packaging.
Conclusion
Hyung-Lae Eun's contributions to semiconductor technology through his patents demonstrate his innovative capabilities and dedication to advancing the industry. His work at Samsung Electronics Co., Ltd. continues to influence the future of electronic devices.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile