The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 16, 2010
Filed:
Nov. 06, 2007
Byung-jo Kim, Daegu-si, KR;
Hyung-lae Eun, Gyeonggi-do, KR;
Sang-jib Han, Gyeonggi-do, KR;
Samsung Electronics Co., Ltd., Gyeonggi-Do, KR;
Abstract
Provided is a semiconductor device package. The semiconductor device package includes: stacked semiconductor chips having bonding pads; a PCB (printed circuit board) mounting the stacked semiconductor chips thereon, and including bonding electrodes that correspond to the bonding pads; and interposers respectively covering the stacked semiconductor chips and interposed between the stacked semiconductor chips. The interposers comprise wire patterns connecting the bonding pads with the bonding electrodes, and connecting the interposers to each other.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile