This inventor holds 1 USPTO granted patent. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2005.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2005
Title: Hyung-Ho Kong: Innovator in Ball Grid Array Chip Technology
Introduction
Hyung-Ho Kong is a prominent inventor based in Seoul, South Korea. He is known for his innovative contributions to the field of electronics, particularly in the development of devices that enhance the efficiency of chip assembly.
Latest Patents
One of his notable patents is a fixing device for securing a ball grid array (BGA) chip on a substrate without the use of soldering. This invention simplifies the process of fixing BGA chips onto printed circuit boards (PCBs). The device features a fixing box with a through-hole, allowing the BGA chip to be settled within it for electrical connection. Additionally, it includes a heat sink, a cover, and a pressing unit that ensures the chip is securely mounted. This method not only eliminates the need for soldering but also allows for easy separation and reuse of the BGA chip.
Career Highlights
Hyung-Ho Kong is currently employed at Samsung Electronics Co., Ltd., where he continues to push the boundaries of technology. His work has significantly impacted the efficiency of electronic device manufacturing.
Collaborations
He collaborates with fellow inventor Sun-Gi Kim, contributing to advancements in their field.
Conclusion
Hyung-Ho Kong's innovative approach to chip assembly technology exemplifies the spirit of invention that drives progress in the electronics industry. His contributions are paving the way for more efficient manufacturing processes.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile