The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 06, 2005
Filed:
Jan. 17, 2003
Hyung-ho Kong, Seoul, KR;
Sun-gi Kim, Seoul, KR;
Hyung-Ho Kong, Seoul, KR;
Sun-Gi Kim, Seoul, KR;
Samsung Electronics Co., Ltd., Suwon-si, KR;
Abstract
The present invention relates to a ball grid array (BGA) chip-fixing device capable of easily fixing the ball grid array (BGA) chip on a printed circuit board (PCB). The device comprises: a fixing box fixed in place on a printed circuit board and having a through-hole; a ball grid array (BGA) chip for being settled within the through-hole of the fixing box to electrically connect with the printed circuit board; a heat sink layered on the upper face of the ball grid array (BGA) chip; a cover fixed over the fixing box; and a pressing unit provided on the underside of the cover for pressing the heat sink in a mounting direction of ball grid array (BGA) chip. The ball grid array (BGA) chip is fixed without soldering, the fixing and separation are simple since the assembly is made via simple screw-fastening, and the ball grid array (BGA) chip can be reused.