Hyun-Su Sim

Title: Hyun-Su Sim: Innovator in Semiconductor Manufacturing

Introduction

Hyun-Su Sim is a prominent inventor based in Cheonan-si, South Korea. He has made significant contributions to the field of semiconductor manufacturing, holding a total of 5 patents. His innovative approaches have advanced the technology used in semiconductor chips, making him a valuable asset in the industry.

Latest Patents

Hyun-Su Sim's latest patents include methods of manufacturing semiconductor chips. These methods involve providing a semiconductor substrate that includes integrated circuit regions and a cut region situated between these regions. The process includes forming a modified layer by emitting a laser beam into the semiconductor substrate along the cut region. Additionally, it involves polishing an inactive surface of the semiconductor substrate to propagate a crack from the modified layer, ultimately separating the integrated circuit regions along the crack. Another notable patent is related to the method of dicing a semiconductor substrate that has a defined scribe lane. This invention includes a semiconductor device with a plurality of semiconductor chips formed on the upper surface of the substrate, along with conductive structures arranged within the scribe lane.

Career Highlights

Hyun-Su Sim is currently employed at Samsung Electronics Co., Ltd., where he continues to innovate in semiconductor technology. His work has been instrumental in enhancing the efficiency and effectiveness of semiconductor manufacturing processes.

Collaborations

Throughout his career, Hyun-Su Sim has collaborated with notable colleagues, including Yoon-Sung Kim and Byung-Moon Bae. These collaborations have fostered a creative environment that has led to groundbreaking advancements in their field.

Conclusion

Hyun-Su Sim's contributions to semiconductor manufacturing exemplify the spirit of innovation. His patents and work at Samsung Electronics Co., Ltd. highlight his role as a leading inventor in the industry.