The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 12, 2020
Filed:
Jan. 21, 2019
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-Do, KR;
Yun-Hee Kim, Cheonan-si, KR;
Yoon-Sung Kim, Seoul, KR;
Byung-Moon Bae, Daegu, KR;
Hyun-Su Sim, Cheonan-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, Gyeonggi-Do, KR;
Abstract
Provided is a semiconductor chip capable of withstanding damage such as cracks created in the fabrication process. A semiconductor chip according to the inventive concept includes: a semiconductor substrate including a residual scribe lane surrounding a die region and a periphery of a die of the die region, a passivation layer covering a portion above the semiconductor substrate, a cover protection layer covering a portion of the passivation layer and the die region, and a cover protection layer formed integrally with a buffering protection layer covering a portion of the residual scribe lane, wherein the buffering protection layer includes a corner protection layer in contact with a portion of an edge adjacent to a corner of the semiconductor substrate, and an extending protection layer extending along the residual scribe lane from the corner protection layer and in contact with the cover protection layer.