Hwaseong-si, South Korea

Hyun Je Kim

USPTO Granted Patents = 12 

 

Average Co-Inventor Count = 6.1

ph-index = 3

Forward Citations = 28(Granted Patents)


Location History:

  • Gyeonggi-do, KR (2016)
  • Hwaseong-si, KR (2019 - 2020)

Company Filing History:


Years Active: 2016-2020

Loading Chart...
Loading Chart...
12 patents (USPTO):Explore Patents

Title: The Innovations of Hyun Je Kim

Introduction

Hyun Je Kim is a prominent inventor based in Hwaseong-si, South Korea. He has made significant contributions to the field of flexible circuit boards, holding a total of 12 patents. His work focuses on enhancing the durability and functionality of electronic components.

Latest Patents

Among his latest patents is a flexible circuit board having enhanced bending durability and a method for preparing the same. This invention provides a method that includes forming a signal line and a first ground layer on a first dielectric body, as well as preparing a second dielectric body. Another notable patent is for a flexible printed circuit board, which features a first substrate part with a first signal line and a second substrate part with a second signal line arranged on the same plane, ensuring effective shielding.

Career Highlights

Hyun Je Kim is currently employed at Gigalane Co., Ltd., where he continues to innovate in the field of electronics. His expertise in flexible circuit technology has positioned him as a key figure in the industry.

Collaborations

He has collaborated with notable coworkers, including Hwang Sub Koo and Hee Seok Jung, contributing to various projects that enhance the capabilities of flexible circuit boards.

Conclusion

Hyun Je Kim's work in flexible circuit technology exemplifies innovation and dedication to improving electronic components. His patents reflect a commitment to advancing the field and addressing the challenges of modern electronics.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…