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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10299375 B1

PDFFull Text
Date of Patent:
May. 21, 2019

Filed:

Mar. 16, 2018

Flexible circuit board having enhanced bending durability

Applicant:

Gigalane Co., Ltd., Hwaseong-si, KR;

Inventors:

Sang Pil Kim, Hwaseong-si, KR;

Da Yeon Lee, Hwaseong-si, KR;

Hwang Sub Koo, Hwaseong-si, KR;

Hyun Je Kim, Hwaseong-si, KR;

Hee Seok Jung, Hwaseong-si, KR;

Assignee:

GigaLane Co., Ltd., Hwaseong-si, Gyeonggi-Do, KR;

Attorney:

Brundidge & Stanger, P.C.

Primary Examiner:

Jeremy C Norris

Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/09 (2006.01); H05K 1/11 (2006.01); H05K 3/46 (2006.01); H05K 3/00 (2006.01); H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
H05K 1/028 (2013.01); H05K 1/024 (2013.01); H05K 1/0242 (2013.01); H05K 1/09 (2013.01); H05K 1/115 (2013.01); H05K 3/4691 (2013.01); H05K 1/0225 (2013.01); H05K 1/0251 (2013.01); H05K 3/0026 (2013.01); H05K 3/0044 (2013.01); H05K 3/28 (2013.01); H05K 2201/093 (2013.01); H05K 2201/0969 (2013.01); H05K 2201/09236 (2013.01); H05K 2201/09618 (2013.01); H05K 2201/09672 (2013.01); H05K 2203/0228 (2013.01); H05K 2203/107 (2013.01);
Abstract

The present invention provides a flexible circuit board having enhanced bending durability. The flexible circuit board comprises: a first board part; a second board part which extends from one side of the first board part and is thinner than the first board part so as to be bendable; and a third board part which extends from one side of the second board part and is thinner than the second board part so as to be bendable.

Find Patent Forward Citations

Kim, Sang. (2019). Flexible circuit board having enhanced bending durability (U.S. Patent No. 10299375). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10299375

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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