The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 23, 2019

Filed:

Mar. 16, 2018
Applicant:

Gigalane Co., Ltd., Hwaseong-si, KR;

Inventors:

Sang Pil Kim, Hwaseong-si, KR;

Da Yeon Lee, Hwaseong-si, KR;

Hwang Sub Koo, Hwaseong-si, KR;

Hyun Je Kim, Hwaseong-si, KR;

Hee Seok Jung, Hwaseong-si, KR;

Assignee:

GIGALANE CO., LTD., Hwaseong-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/02 (2006.01); H05K 3/00 (2006.01); H05K 1/03 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/115 (2013.01); H05K 1/028 (2013.01); H05K 1/0225 (2013.01); H05K 1/0393 (2013.01); H05K 3/0044 (2013.01); H05K 3/4694 (2013.01); H05K 3/4697 (2013.01); H05K 2201/093 (2013.01); H05K 2201/09236 (2013.01); H05K 2201/09327 (2013.01);
Abstract

Disclosed is a flexible circuit board having a three-layer dielectric body and four-layer ground layer structure. A flexible circuit board having a three-layer dielectric body and four-layer ground layer structure, according to the present invention, comprises: a first dielectric body; a second dielectric body facing the flat surface of the first dielectric body; a third dielectric body facing the bottom side of the first dielectric body; a signal line formed on the flat surface of the first dielectric body; a pair of first ground layers laminated on the flat surface of the first dielectric body and having the signal line therebetween; second ground layers laminated on the bottom side of the first dielectric body so as to correspond to the first ground layers; a third ground layer laminated on the flat surface of the second dielectric body; and a fourth ground layer laminated on the bottom side of the third dielectric body.


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