Hwaseong-si, South Korea

Hyuek Jae Lee

USPTO Granted Patents = 9 

Average Co-Inventor Count = 4.2

ph-index = 3

Forward Citations = 55(Granted Patents)


Location History:

  • Daejeon, KR (2005 - 2006)
  • Hwaseong-si, KR (2021 - 2024)

Company Filing History:


Years Active: 2005-2024

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9 patents (USPTO):Explore Patents

Title: Innovations by Inventor Hyuek Jae Lee

Introduction

Hyuek Jae Lee is a prominent inventor based in Hwaseong-si, South Korea, renowned for his contributions to the field of semiconductor technology. With a portfolio of 9 patents, Lee has made significant strides in the design and manufacturing of semiconductor packages. His inventions reflect a deep understanding of the complexities involved in semiconductor integration and performance enhancement.

Latest Patents

Hyuek Jae Lee's latest patents focus on advanced semiconductor packaging solutions. One notable patent describes a semiconductor package that includes a base featuring a first bonding structure and a first semiconductor chip with an innovative second bonding structure. This design incorporates essential elements such as a test pad and insulating layers, enhancing electrical connections and reliability between components.

Another critical patent details a method for manufacturing a semiconductor package that optimizes the layering and bonding of semiconductor chips. This method features a base structure integrated with two semiconductor chips, connected through meticulously designed insulation layers. Lee's inventive approach aims to improve efficiency and performance in semiconductor applications.

Career Highlights

Throughout his career, Hyuek Jae Lee has worked with leading organizations, including Samsung Electronics Co., Ltd. and the Korea Advanced Institute of Science and Technology. His experience in these esteemed institutions has provided him with the platform to develop groundbreaking innovations that are pivotal in the semiconductor industry.

Collaborations

In his journey as an inventor, Hyuek Jae Lee has collaborated with talented professionals like Ji Hwan Hwang and Jae Hyun Kim. These collaborations have contributed to the success of his projects and have fostered an environment of innovation and creativity. Working alongside these experts has allowed Lee to refine his ideas and bring cutting-edge solutions to life.

Conclusion

Hyuek Jae Lee’s innovative contributions to semiconductor technology exemplify his dedication to advancing the field. With 9 patents underscoring his expertise, his work not only reflects technical prowess but also a commitment to enhancing the efficiency of semiconductor packages. As he continues to innovate, the industry eagerly anticipates what new inventions he will unveil in the future.

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