Company Filing History:
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Years Active: 2015
Title: Hyuck Mo Lee: Innovator in Lead-Free Solder Technology
Introduction
Hyuck Mo Lee is a notable inventor based in Daejeon, South Korea. He has made significant contributions to the field of semiconductor technology, particularly through his innovative work on lead-free solder materials. His inventions focus on creating environmentally friendly solutions that maintain high performance and reliability.
Latest Patents
Hyuck Mo Lee holds a patent for a lead-free solder bumps technology. This invention includes a lead-free solder that comprises copper (Cu) in a range from about 0.1 wt % to about 0.8 wt %, palladium (Pd) from about 0.001 wt % to about 0.1 wt %, aluminum (Al) from about 0.001 wt % to about 0.1 wt %, silicon (Si) from about 0.001 wt % to about 0.1 wt %, and tin (Sn) along with inevitable impurities as the remainder. The solder paste and semiconductor device utilizing this lead-free solder are designed to be environmentally friendly while offering high-temperature stability and reliability. He has 1 patent to his name.
Career Highlights
Throughout his career, Hyuck Mo Lee has worked with various organizations, including Mk Electron Co., Ltd. and Hoseo University Academic Cooperation Foundation. His experience in these companies has allowed him to develop and refine his innovative solder technologies.
Collaborations
Hyuck Mo Lee has collaborated with notable colleagues such as Sung Jae Hong and Keun Soo Kim. These partnerships have contributed to the advancement of his research and the successful development of his patented technologies.
Conclusion
Hyuck Mo Lee is a prominent figure in the field of lead-free solder technology, with a focus on creating sustainable and reliable solutions for the semiconductor industry. His contributions continue to impact the field positively.