The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 13, 2015
Filed:
Dec. 02, 2014
MK Electron Co., Ltd., Gyeonggi-do, KR;
Hoseo University Academic Cooperation Foundation, Chungcheongnam-do, KR;
Korea Advanced Institute of Science and Technology, Daejeon, KR;
Korea Institute of Industrial Technology, Chungcheongnam-do, KR;
Korea Electronics Technology Institute, Gyeonggi-do, KR;
Sung Jae Hong, Gyeonggi-do, KR;
Keun Soo Kim, Chungcheongnam-do, KR;
Chang Woo Lee, Chungcheongnam-do, KR;
Jung Hwan Bang, Chungcheongnam-do, KR;
Yong Ho Ko, Chungcheongnam-do, KR;
Hyuck Mo Lee, Deajeon, KR;
Jae Won Chang, Daejeon, KR;
Ja Hyun Koo, Daejeon, KR;
Jeong Tak Moon, Gyeonggi-do, KR;
Young Woo Lee, Incheon, KR;
Won Sik Hong, Gyeonggi-do, KR;
Hui Joong Kim, Seoul, KR;
Jae Hong Lee, Seoul, KR;
Abstract
Provided are a lead-free solder, a solder paste, and a semiconductor device, and more particularly, a lead-free solder that includes Cu in a range from about 0.1 wt % to about 0.8 wt %, Pd in a range from about 0.001 wt % to about 0.1 wt %, Al in a range from about 0.001 wt % to about 0.1 wt %, Si in a range from about 0.001 wt % to about 0.1 wt %, and Sn and inevitable impurities as remainder, a solder paste and a semiconductor device including the lead-free solder. The lead-free solder and the solder paste are environment-friendly and have a high high-temperature stability and high reliability.