This inventor holds 3 USPTO granted patents and 1 published patent application. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2011-2016.
Location History:
- Chungcheongnam-do, KR (2011)
- Cheonan-si, KR (2014 - 2016)
Company Filing History:
Years Active: 2011-2016
Title: Hyoung-Suk Kim: Innovator in Semiconductor Packaging
Introduction
Hyoung-Suk Kim is a prominent inventor based in Cheonan, South Korea. He has made significant contributions to the field of semiconductor packaging, holding a total of 3 patents. His work focuses on innovative designs that enhance the functionality and efficiency of semiconductor devices.
Latest Patents
One of Hyoung-Suk Kim's latest patents is titled "Semiconductor package having supporting plate and method of forming the same." This invention describes a semiconductor package that includes a packaging substrate, a first semiconductor chip positioned on the substrate, and a support plate. The support plate is strategically spaced apart from the first semiconductor chip, allowing for the placement of a second semiconductor chip on both the first chip and the support plate. This configuration ensures that the first semiconductor chip is sandwiched between the second chip and the packaging substrate, while the support plate is also positioned between the second chip and the substrate. An adhesion layer is utilized to bond the second semiconductor chip to both the first chip and the support plate, and an electrical coupling is established between the first semiconductor chip and the packaging substrate.
Career Highlights
Hyoung-Suk Kim is currently employed at Samsung Electronics Co., Ltd., a leading company in the technology sector. His work at Samsung has allowed him to push the boundaries of semiconductor technology and contribute to advancements in the industry.
Collaborations
Throughout his career, Hyoung-Suk Kim has collaborated with notable colleagues, including Tae-Duk Nam and Jin-Ho Kim. These collaborations have fostered a creative environment that has led to innovative solutions in semiconductor packaging.
Conclusion
Hyoung-Suk Kim's contributions to semiconductor packaging demonstrate his commitment to innovation and excellence in technology. His patents reflect a deep understanding of the complexities involved in semiconductor design, and his work continues to influence the industry.