This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Samsung Electronics Ltd.. Active years: 2026.
Company Filing History:
Years Active: 2026
Title: Hyonchol Kim: Innovator in Semiconductor Packaging
Introduction
Hyonchol Kim is a notable inventor based in Suwon, South Korea. He has made significant contributions to the field of semiconductor packaging, showcasing his expertise through innovative designs and solutions. His work is particularly recognized for enhancing the efficiency and functionality of semiconductor devices.
Latest Patents
Hyonchol Kim holds a patent for a semiconductor package that includes a package substrate featuring a redistribution layer, a lower protective layer, and multiple support protrusions. The design incorporates first and second pads on the redistribution layer, with the lower protective layer containing first openings and a trench that exposes the second pads. Additionally, the semiconductor chip is connected to the redistribution layer, and the package includes an encapsulant, connection bumps, a passive device, and a sealant. This innovative design aims to improve the performance and reliability of semiconductor packages.
Career Highlights
Hyonchol Kim is currently employed at Samsung Electronics Ltd., a leading global technology company. His role at Samsung has allowed him to work on cutting-edge technologies and contribute to advancements in semiconductor packaging. His patent reflects his commitment to innovation and excellence in his field.
Collaborations
Hyonchol Kim has collaborated with talented colleagues, including Choongbin Yim and Sungbum Kim. These partnerships have fostered a creative environment that encourages the development of groundbreaking technologies in semiconductor packaging.
Conclusion
Hyonchol Kim's contributions to semiconductor packaging exemplify his innovative spirit and dedication to advancing technology. His patent and work at Samsung Electronics Ltd. highlight his role as a key player in the industry.